International Circuits offers a virtually unlimited range of capabilities and tolerances. Our goal is to meet any demand placed within the scope of today's technology and
to constantly develop our processes so that we can continue to supply an advanced level of capabilities and product reliability in the future.
If you do not see the required specification for your board here, please contact us. Through our strategic partnerships we have the ability
to manufacture essentially any board you can design at the same competitive pricing you would expect from International Circuits.
| Board Attributes | Details |
| Order Quantity |
Prototype to Full Production |
| Maximum Layer Count |
42 Layers |
| Minimum Core Thickness Without Copper |
0.002" |
| Maximum Board Thickness |
0.450" |
| Overall Board Thickness Tolerance |
+/- 10% (standard) to +/- 5% |
| Layer to Layer Registration |
+/- 0.003" |
| Minimum Line Width/Space |
0.002" / 0.002" |
| Minimum SMT Pitch |
0.0025" |
| Minimum BGA Pitch |
0.004" |
| Minimum Hole Size (Mechanical Drill) |
0.008" |
| Minimum Hole Size (Laser Drill) |
0.003" |
| Aspect Ratio |
15:1 |
| Via Technology | Blind Vias, Buried Vias, Micro Vias, Tented Vias
Conductive/Nonconductive Plugged Vias, Via in Pad |
| Fab Technology/Special Processes | Countersink, Counterbore,
Routed Array, V Score
Jump Score, Heatsink, Edge Milling/Beleving/Plating
Plated Edges, Plated Slots,
Controlled Dielectric
Class 3, BGA
|
| Impedance Control Tolerance | +/- 10% to +/- 5% |
| Copper Weight Range | 0.3 oz to 20.0 oz |
| Laminate Material | Fr-4, Fr-5, Aluminum, Arlon, Gentek,
Nelco, Polyimide, Rogers 4000 Series |
| Surface Finishing | HASL, Lead free HASL (RoHS), OSP (Entek)
Immersion Silver,
Immersion Tin, Carbon Ink
ENIG, Electrolytic Flash Gold, Hard Gold
Wirebondable Gold, Gold Finger, Peelable Mask |
| Solder Mask Colors | White, Yellow, Green, Red, Blue, Black
Matte Green, Matte Black |
| Legend Colors | White, Yellow, Red, Black |
| Certifications | ISO-9001-2000, UL, RoHS |
|
