Materials

Test ItemUnitTest Method
(IPC-TM-650)
Test ConditionSpecification
(IPC-4101C)
Typical Value
Peel Strength (1 oz.)N/mm2.4.8125 ℃

Float 288 ℃ / 10 sec
≥0.70

≥1.05
1.70
1.75
Thermal StressSec2.4.13.1Float 288℃ / unetched≥10180
Bow / Twist%2.4.22.1A≤1.00.17 / 0.35
Flexural StrengthN/mm22.4.4Warp
Fill
≥415
≥345
565
416
FlammabilityRatingUL94UL94UL94 V-0V-0
Glass Transition (Tg)2.4.25E-2/105 DSC≥130135
Surface Resistivity2.5.17.1C-96/35/90≥1.0×1041.0×106
Volume ResistivityMΩ-cm2.5.17.1C-96/35/90≥1.0×1061.0×108
Dielectric Constant___2.5.5.2Etched/@1 MHZ≤5.44.58
Loss Tangent___2.5.5.2Etched/@1 MHZ≤0.0350.022
Arc ResistanceSec2.5.1D-48/50+D-0.5/23≥60125
Moisture Absorption%2.6.2.1D-24/23≤0.35(min0.51mm)
≤0.80(max0.51mm)
0.21
0.19
Z-axis Expansionppm/%2.4.24E-2/105 TMA______58/286
TD2.4.24.6TGA______305
T-260min2.4.24.1TMA______10
Test ItemUnitTest Method
(IPC-TM-650)
Test ConditionSpecification
(IPC-4101C)
Typical Value
Peel Strength (1 oz.)N/mm2.4.8125 ℃

Float 288 ℃ / 10 sec
≥0.70

≥1.05
1.35
1.42
FlammabilityRatingUL94E-24/23UL94 V-0V-0
Thermal StressSec2.4.13.1Float 288℃ / unetched≥1060
Glass Transition (Tg)2.4.25E-2/105 DSC≥150153
Surface Resistivity2.5.17.1C-96/35/90≥1.0×104≥1.0×107
Volume ResistivityMΩ-cm2.5.17.1C-96/35/90≥1.0×106≥1.0×109
Moisture Absorption%2.6.2.1D-24/23≤0.35(min0.51mm)
≤0.80(max0.51mm)
0.16
0.30
Dielectric BreakdownKV2.5.6D-48/50+D0.5/23≥4072
Dielectric StrengthKV/mm2.5.6.2D-48/50+D0.5/23≥2946
Flexural StrengthN/mm22.4.4Warp
Fill
≥415
≥345
560
430
Dielectric Constant___2.5.5.2Etched/@1 MHZ≤5.44.65
Loss Tangent___2.5.5.2Etched/@1 MHZ≤0.0350.018
Arc ResistanceSec2.5.1D-48/50+D0.5/23≥60125
CTE Z-Axis
Expansion
ppm/℃
% (50-260℃)
2.4.24E-2/105 TMA≥60/300
≤3.5
55/287
3.1
TD2.4.24.6TGA≥325335
CAFH___TGA
85%, 85℃, 50V DC
≥10001000
T-260min2.4.24.1TMA≥3050
T-288min2.4.24.1TMA≥523
Test ItemUnitTest Method
(IPC-TM-650)
Test ConditionSpecification
(IPC-4101C)
Typical Value
Peel Strength (1 oz.)N/mm2.4.8125 ℃

Float 288 ℃ / 10 sec
AABUS
AABUS
1.30
1.25
FlammabilityRatingUL94E-24/23UL94 V-0V-0
Glass Transition (Tg)2.4.25E-2/105 DSC≥170175
Surface Resistivity2.5.17.1C-96/35/90≥1.0×1041.0×107
Volume ResistivityMΩ-cm2.5.17.1C-96/35/90≥1.0×1061.0×109
Dielectric BreakdownkV2.5.6D-48/50+D0.5/23≥4070
Dielectric StrengthkV/mm2.5.6.2D-48/50+D0.5/23≥2944
Dielectric Constant___2.5.5.2Etched/@1 MHZ≤5.44.65
Loss Tangent___2.5.5.2Etched/@1 MHZ≤0.0350.018
Moisture Absorption%2.6.2.1D-24/23≤0.35(min0.51)
≤0.80(max0.51)
.15
0.25
Flexural StrengthN/mm22.4.4Warp
Fill
≥415
≥345
589
456
Arc ResistanceSec2.5.1D-48/50+D0.5/23≥60125
CTE Z-Axis Expansionppm/℃
% (50-260℃)
2.4.24E-2/105 TMA≥60/300
≤3.0
46/267
2.8
CTIVIEC 60112Etched/0.1% NH4CL≥175175
TD2.4.24.6TGA≥340357
CAFH___TGA
85%, 85℃, 50V DC
≥340
≥1000
1000
T-260min2.4.24.1TMA≥3050
T-288min2.4.24.1TMA≥1530
international sircuits
THE SUPPLIER OF CHOICE FOR OVER 2000 CUSTOMERS WORLDWIDE

one-stop source for printed circuit board fabrication and PCB prototyping.

CONTACT US
×