- A
- Annular Ring
- Array
- Artwork Master
- Aspect Ratio
- Assembly
- Assembly File
- Assembly House
- Automated Test Equipment (ATE)
- Analog Circuit
- Additive Process
- Activating
- C
- CAM
- Catalyst
- C-Stage
- Capacitance
- Center to Center Spacing
- Chamfer
- Chip on Board (COB)
- Circuitry Layer
- Clad
- Clearance Hole
- Coating
- Coefficient of Thermal Expansion (CTE)
- Component Hole
- Component Side
- Computer Numeric Control (CNC)
- Conductor
- Conductor Spacing
- Conductor Thickness
- Conformal Coating
- Connector Area
- Controlled Impedance
- Copper Foil
- Core Thickness
- Corrosive Flux
- Crosshatching
- Curing
- Curing Time
- CAD
- D
- Date Code
- Deburring
- Delamination
- Design Rule
- Design Rule Checking
- Desmear
- Dielectric
- Digitizing
- Dimensional Stability
- Double-Sided Assembly
- Double-Sided Board
- Dry-Film Resists
- Dry-Film Solder Mask
- Dual In-Line Package (DIP)
- E
- Edge Clearance
- Edge Connector
- Electroless Copper
- Electrical Continuity
- Electroless Deposition
- Electroplating
- Epoxy
- Epoxy Smear
- Etchback
- Etching
- I
- Imaging
- Immersion Plating
- Impedancev
- In-Circuit Test
- Inner Layers
- Insulation Resistance
- Interconnect Stress Test (IST)
- Interstitial Via Hole
- L
- Laminate
- Laminate Thickness
- Laminate Void
- Land
- Lead
- Leakage Current
- Legend
- Line
- Liquid Photo-Imageable Solder Mask (LPI)
- P
- Pad
- Panel
- Pattern
- Pattern Plating
- PEC
- Photo Print
- Photographic Image
- Photoplotting
- Photo Resist
- Pin
- Pitch
- Plated Through Hole (PTH)
- Plating Resist
- Plating Void
- Plotting
- Prepreg
- Printed Circuit Board (PCB)
- Printed Wiring Board (PWB)
- Prototye
- Pulse Plating
- S
- Screen Printing
- Silk Screen
- Single-Sided Board
- Small Outline Integrated Circuit (SOIC)
- SMD
- SMOBC
- Solder
- Solder Bridging
- Solder Coat
- Solder Leveling
- Solder Mask
- Surface Mount Technology (SMT)
- Statistical Process Control (SPC)
- Step-And-Repeat
- Substrate
