RIGID PCB

International Circuits provides high quality printed circuit board fabrication at extremely competitive pricing. Whether you need a few quick turn PCB prototypes or mass production, our world class manufacturing services can meet your specialized pcb requirements.

Combining over a decade of experience with the most up to date manufacturing efficiencies allow our pricing to be among the most competitive. All of our products are manufactured based on IPC guidelines and comply with ISO-9001-2000, UL, and RoHS standards.

Try our online PCB Quote for real-time quoting and ordering (no registration required).

PCB Types

  • CAP or Foil Construction
  • Blind / Buried Via
  • Mixed Inner Copper Weights
  • Rigid-Flex
  • Aluminum Core (single sided to multi-layer)
  • Controlled Impedance
  • Mixed Materials
  • Flex
  • PCB High Density
  • (HDI) High Density Interconnect Via-In-Pad Process

RIGID PCB Capabilities and Tolerances

Below are the circuit board capabilities and tolerances that we can currently manufacture. We are working to expand our PCB offerings so please revisit this page frequently for updates. We offer very high-end features and capabilities at competitive pricing:

  • Rigid PCBs up to 42 layers
  • 3-mil traces and 3.5-mil spaces
  • Minimum Mechanical drill size 8-mil
  • Minimum Laser drill size 3-mil
  • ISO-9001 and UL certified & Controlled Impedance
  • Blind / Buried Vias
  • Class III
  • RoHS Compliant (all options available)
  • High temperature, high frequency material
  • Aluminum and other special material

LAMINATE

ItemEnglishMetric
Max Board Thickness314.96 mil8.000 mm
Min Board Thickness (2 Layers)10 mil0.254 mm
Min Board Thickness (4 Layers)11.8 mil0.300 mm
Min Core Thickness (Not including copper)2 mil0.051 mm
Largest Panel Size23.62" x 39.37"599.95 mm x 1000 mm
Min Pre-Preg Thickness2.3 mil0.058 mm
Board Thickness Tolerance (Standard)±10% or ±5 milwhichever is greater ±5%
Board Thickness Tolerance (Upon Request)±10% or ±5 milwhichever is greater ±5%

DRILL

ItemEnglishMetric
Min Drill Size6 mil0.15 mm
Min Laser Drill Size3 mil0.076 mm
Min Mechanical Aspect Ratio (Laminate / Drill)12 / 1

SURFACE FINISHES

ItemEnglish
Lead Solder (HASL)OSP (Entek)
Lead Free Solder (HASL)Deep/Hard/Flash Gold (Electrolytic Nickel Gold)
Immersion Gold (Electroless Nickel Gold - ENIG)Wirebondable Gold (99.99% Pure Gold)
Immersion SilverCarbon Ink
Immersion Tin (White Tin)Gold Finger (Hard Gold)

CONTROLLED IMPEDANCE

ItemMetric
Controlled Impedance (Standard)±10%
Controlled Impedance (Upon Request)±7%

COPPER

ItemEnglishMetric
Max Inner Layer Copper Thickness6 oz0.20 mm
Min Inner Layer Copper Thickness0.3 oz0.01 mm
Max Outer Layer Copper Thickness11 oz0.383 mm
Min Outer Layer Copper Thickness (no plating in holes)0.25 oz0.009 mm

SOLDER MASK

ItemEnglishMetric
Min Solder Mask Print Width (Mask Dam)4 mil0.102 mm
Solder Mask Registration Tolerance±2 mil0.051 mm

TRACES / SPACES

ItemEnglishMetric
Min Line Width / Spacing (Outer Layer)3 / 3.5 mil0.076 mm / 0.089 mm
Min Line Width / Spacing (Inner Layer)3 / 3.5 mil0.076 mm / 0.089 mm
Min Copper Space to outline CNC Route/Score10/12 mil0.25 mm / 0.3 mm

SOLDER MASK COLORS

ItemSILK SCREEN COLORS
Green, Matte Green, Light Green, Black,White, Black, Yellow, Red, Blue, Green
Matte Black, White, Yellow, Red, Blue, Clear3 / 3.5 mil

MATERIALS

ItemEnglish
FR4 (135°C Tg)Flex
FR4 (170°C - 180°C Tg)Rigid-Flex
Aluminum
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