International Circuits provides high quality printed circuit board fabrication at extremely competitive pricing. Whether you need a few quick turn PCB prototypes or mass production, our world class manufacturing services can meet your specialized pcb requirements.
Combining over a decade of experience with the most up to date manufacturing efficiencies allow our pricing to be among the most competitive. All of our products are manufactured based on IPC guidelines and comply with ISO-9001-2000, UL, and RoHS standards.
Try our online PCB Quote for real-time quoting and ordering (no registration required).
PCB Types
- CAP or Foil Construction
- Blind / Buried Via
- Mixed Inner Copper Weights
- Rigid-Flex
- Aluminum Core (single sided to multi-layer)
- Controlled Impedance
- Mixed Materials
- Flex
- PCB High Density
- (HDI) High Density Interconnect Via-In-Pad Process
RIGID PCB Capabilities and Tolerances
Below are the circuit board capabilities and tolerances that we can currently manufacture. We are working to expand our PCB offerings so please revisit this page frequently for updates. We offer very high-end features and capabilities at competitive pricing:
- Rigid PCBs up to 42 layers
- 3-mil traces and 3.5-mil spaces
- Minimum Mechanical drill size 8-mil
- Minimum Laser drill size 3-mil
- ISO-9001 and UL certified & Controlled Impedance
- Blind / Buried Vias
- Class III
- RoHS Compliant (all options available)
- High temperature, high frequency material
- Aluminum and other special material
LAMINATE
| Item | English | Metric |
|---|---|---|
| Max Board Thickness | 314.96 mil | 8.000 mm |
| Min Board Thickness (2 Layers) | 10 mil | 0.254 mm |
| Min Board Thickness (4 Layers) | 11.8 mil | 0.300 mm |
| Min Core Thickness (Not including copper) | 2 mil | 0.051 mm |
| Largest Panel Size | 23.62" x 39.37" | 599.95 mm x 1000 mm |
| Min Pre-Preg Thickness | 2.3 mil | 0.058 mm |
| Board Thickness Tolerance (Standard) | ±10% or ±5 mil | whichever is greater ±5% |
| Board Thickness Tolerance (Upon Request) | ±10% or ±5 mil | whichever is greater ±5% |
DRILL
| Item | English | Metric |
|---|---|---|
| Min Drill Size | 6 mil | 0.15 mm |
| Min Laser Drill Size | 3 mil | 0.076 mm |
| Min Mechanical Aspect Ratio (Laminate / Drill) | 12 / 1 |
SURFACE FINISHES
| Item | English |
|---|---|
| Lead Solder (HASL) | OSP (Entek) |
| Lead Free Solder (HASL) | Deep/Hard/Flash Gold (Electrolytic Nickel Gold) |
| Immersion Gold (Electroless Nickel Gold - ENIG) | Wirebondable Gold (99.99% Pure Gold) |
| Immersion Silver | Carbon Ink |
| Immersion Tin (White Tin) | Gold Finger (Hard Gold) |
CONTROLLED IMPEDANCE
| Item | Metric |
|---|---|
| Controlled Impedance (Standard) | ±10% |
| Controlled Impedance (Upon Request) | ±7% |
COPPER
| Item | English | Metric |
|---|---|---|
| Max Inner Layer Copper Thickness | 6 oz | 0.20 mm |
| Min Inner Layer Copper Thickness | 0.3 oz | 0.01 mm |
| Max Outer Layer Copper Thickness | 11 oz | 0.383 mm |
| Min Outer Layer Copper Thickness (no plating in holes) | 0.25 oz | 0.009 mm |
SOLDER MASK
| Item | English | Metric |
|---|---|---|
| Min Solder Mask Print Width (Mask Dam) | 4 mil | 0.102 mm |
| Solder Mask Registration Tolerance | ±2 mil | 0.051 mm |
TRACES / SPACES
| Item | English | Metric |
|---|---|---|
| Min Line Width / Spacing (Outer Layer) | 3 / 3.5 mil | 0.076 mm / 0.089 mm |
| Min Line Width / Spacing (Inner Layer) | 3 / 3.5 mil | 0.076 mm / 0.089 mm |
| Min Copper Space to outline CNC Route/Score | 10/12 mil | 0.25 mm / 0.3 mm |
SOLDER MASK COLORS
| Item | SILK SCREEN COLORS |
|---|---|
| Green, Matte Green, Light Green, Black, | White, Black, Yellow, Red, Blue, Green |
| Matte Black, White, Yellow, Red, Blue, Clear | 3 / 3.5 mil |
MATERIALS
| Item | English |
|---|---|
| FR4 (135°C Tg) | Flex |
| FR4 (170°C - 180°C Tg) | Rigid-Flex |
| Aluminum |
one-stop source for printed circuit board fabrication and PCB prototyping.